Ultrasonic and thermo-compression gold-to-gold bonding of narrow frames for hermetic cavity sealing and electrical interconnect

T Zoumpoulidis; J van Delft; M de Wild; PEM Kuijpers; P de Graaf; R Mauczok; K Biju; M Bartek; R Dekker; M Klee

Ultrasonic and thermo-compression gold-to-gold bonding of narrow frames for hermetic cavity sealing and electrical interconnect

T Zoumpoulidis, J van Delft, M de Wild, PEM Kuijpers, P de Graaf, R Mauczok, K Biju, M Bartek, R Dekker, M Klee

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

1 Citation (Scopus)

Original language	Undefined/Unknown
Title of host publication	Proc. 33rd international electronics manufacturing technology conference
Editors	s.n.
Place of Publication	s.l.
Publisher	IEEE Society
Pages	1-7
Number of pages	7
Publication status	Published - 2008
Event	IEMT 2008, Penang, Malasya - s.l. Duration: 4 Nov 2008 → 6 Nov 2008

Publication series

Name
Publisher	IEEE

Conference

Conference	IEMT 2008, Penang, Malasya
Period	4/11/08 → 6/11/08

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

Zoumpoulidis, T., van Delft, J., de Wild, M., Kuijpers, PEM., de Graaf, P., Mauczok, R., Biju, K., Bartek, M., Dekker, R., & Klee, M. (2008). Ultrasonic and thermo-compression gold-to-gold bonding of narrow frames for hermetic cavity sealing and electrical interconnect. In s.n. (Ed.), Proc. 33rd international electronics manufacturing technology conference (pp. 1-7). IEEE Society.

@inproceedings{8dbe4aba1b3b4a0cbe583b4676742983,

title = "Ultrasonic and thermo-compression gold-to-gold bonding of narrow frames for hermetic cavity sealing and electrical interconnect",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "T Zoumpoulidis and {van Delft}, J and {de Wild}, M and PEM Kuijpers and {de Graaf}, P and R Mauczok and K Biju and M Bartek and R Dekker and M Klee",

year = "2008",

language = "Undefined/Unknown",

publisher = "IEEE Society",

pages = "1--7",

editor = "s.n.",

booktitle = "Proc. 33rd international electronics manufacturing technology conference",

note = "IEMT 2008, Penang, Malasya ; Conference date: 04-11-2008 Through 06-11-2008",

}

Zoumpoulidis, T, van Delft, J, de Wild, M, Kuijpers, PEM, de Graaf, P, Mauczok, R, Biju, K, Bartek, M, Dekker, R & Klee, M 2008, Ultrasonic and thermo-compression gold-to-gold bonding of narrow frames for hermetic cavity sealing and electrical interconnect. in s.n. (ed.), Proc. 33rd international electronics manufacturing technology conference. IEEE Society, s.l., pp. 1-7, IEMT 2008, Penang, Malasya, 4/11/08.

Ultrasonic and thermo-compression gold-to-gold bonding of narrow frames for hermetic cavity sealing and electrical interconnect. / Zoumpoulidis, T; van Delft, J; de Wild, M et al.
Proc. 33rd international electronics manufacturing technology conference. ed. / s.n. s.l.: IEEE Society, 2008. p. 1-7.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Ultrasonic and thermo-compression gold-to-gold bonding of narrow frames for hermetic cavity sealing and electrical interconnect

AU - Zoumpoulidis, T

AU - van Delft, J

AU - de Wild, M

AU - Kuijpers, PEM

AU - de Graaf, P

AU - Mauczok, R

AU - Biju, K

AU - Bartek, M

AU - Dekker, R

AU - Klee, M

PY - 2008

Y1 - 2008

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SP - 1

EP - 7

BT - Proc. 33rd international electronics manufacturing technology conference

A2 - s.n., null

PB - IEEE Society

CY - s.l.

T2 - IEMT 2008, Penang, Malasya

Y2 - 4 November 2008 through 6 November 2008

ER -