Understanding the transport phenomena leading to tarnishing of the reflecting silver layer causing reduced light output of LEDs

A. Herrmann, S. J.F. Erich, L. G.J.V.D. Ven, W. D. Van Driel, M. Van Soestbergen, A. Mavinkurve, F. De Buyl, O. C.G. Adan

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Abstract

Tarnishing of the reflective silver layer in LED packages is an important failure mechanism, leading to both a decrease in luminous flux by up to 75% and a change in color spectrum.

Original languageEnglish
Title of host publication2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
ISBN (Electronic)9781509043446
DOIs
Publication statusPublished - 10 May 2017
Externally publishedYes
Event18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017: 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Dresden, Germany
Duration: 3 Apr 20175 Apr 2017

Conference

Conference18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017
CountryGermany
CityDresden
Period3/04/175/04/17

Fingerprint Dive into the research topics of 'Understanding the transport phenomena leading to tarnishing of the reflecting silver layer causing reduced light output of LEDs'. Together they form a unique fingerprint.

  • Cite this

    Herrmann, A., Erich, S. J. F., Ven, L. G. J. V. D., Van Driel, W. D., Van Soestbergen, M., Mavinkurve, A., De Buyl, F., & Adan, O. C. G. (2017). Understanding the transport phenomena leading to tarnishing of the reflecting silver layer causing reduced light output of LEDs. In 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017 [7926238] Institute of Electrical and Electronics Engineers (IEEE). https://doi.org/10.1109/EuroSimE.2017.7926238