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Vacuum assisted liquified metal (VALM) TSV filling method with superconductive material
J.A. Alfaro, P.M. Sberna, C. Silvestri, M. Mastrangeli, R. Ishihara, P.M. Sarro
Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review
7
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(Scopus)
103
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