Fingerprint
Dive into the research topics of 'Vacuum assisted liquified metal (VALM) TSV filling method with superconductive material'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Vacuum assisted liquified metal (VALM) TSV filling method with superconductive material
J.A. Alfaro, P.M. Sberna, C. Silvestri, M. Mastrangeli, R. Ishihara, P.M. Sarro
Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review
7
Citations
(Scopus)
141
Downloads
(Pure)