Verification of Drop Impact Simulations Using High-Speed Camera Measurements

JJM Zaal, WD van Driel, FJHG Kessels, GQ Zhang

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

6 Citations (Scopus)

Abstract

The increased use of mobile appliances in today's society has resulted in an increase of reliability issues related to drop performance. A common method to assess the drop performance is the JEDEC specified drop impact test [1]. In this research the solder loading is investigated by means of drop impact simulations and high-speed camera measurements. The measurements are used to enhance the simulations by tuning the damping parameters. This results in models that are replicating the drop impact amplitudes and are thereby capable of determining the critical solder joint.
Original languageUndefined/Unknown
Title of host publication2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA
Editors Wipiejewski, T., Trewhella, J.
Place of PublicationOrlando, FL, USA
PublisherIEEE Society
Pages2149-2155
Number of pages7
ISBN (Print)978-1-4244-2231-9
Publication statusPublished - 2008
Event58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA - Orlando, FL, USA
Duration: 27 May 200830 May 2008

Publication series

Name
PublisherIEEE

Conference

Conference58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA
Period27/05/0830/05/08

Keywords

  • conference contrib. refereed
  • Conf.proc. > 3 pag

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