Verification of Drop Impact Simulations Using High-Speed Camera Measurements

JJM Zaal; WD van Driel; FJHG Kessels; GQ Zhang

Verification of Drop Impact Simulations Using High-Speed Camera Measurements

JJM Zaal, WD van Driel, FJHG Kessels, GQ Zhang

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

Abstract

The increased use of mobile appliances in today's society has resulted in an increase of reliability issues related to drop performance. A common method to assess the drop performance is the JEDEC specified drop impact test [1]. In this research the solder loading is investigated by means of drop impact simulations and high-speed camera measurements. The measurements are used to enhance the simulations by tuning the damping parameters. This results in models that are replicating the drop impact amplitudes and are thereby capable of determining the critical solder joint.

Original language	Undefined/Unknown
Title of host publication	2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA
Editors	Wipiejewski, T., Trewhella, J.
Place of Publication	Orlando, FL, USA
Publisher	IEEE
Pages	2149-2155
Number of pages	7
ISBN (Print)	978-1-4244-2231-9
Publication status	Published - 2008
Event	58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA - Orlando, FL, USA Duration: 27 May 2008 → 30 May 2008

Publication series

Name
Publisher	IEEE

Conference

Conference	58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA
Period	27/05/08 → 30/05/08

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

@inproceedings{89ad1e517bb443ffbcf9a89162e9b713,

title = "Verification of Drop Impact Simulations Using High-Speed Camera Measurements",

abstract = "The increased use of mobile appliances in today's society has resulted in an increase of reliability issues related to drop performance. A common method to assess the drop performance is the JEDEC specified drop impact test [1]. In this research the solder loading is investigated by means of drop impact simulations and high-speed camera measurements. The measurements are used to enhance the simulations by tuning the damping parameters. This results in models that are replicating the drop impact amplitudes and are thereby capable of determining the critical solder joint.",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "JJM Zaal and {van Driel}, WD and FJHG Kessels and GQ Zhang",

year = "2008",

language = "Undefined/Unknown",

isbn = "978-1-4244-2231-9",

publisher = "IEEE",

pages = "2149--2155",

editor = "{Wipiejewski, T.} and {Trewhella, J.}",

booktitle = "2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA",

address = "United States",

note = "58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA ; Conference date: 27-05-2008 Through 30-05-2008",

}

Zaal, JJM, van Driel, WD, Kessels, FJHG & Zhang, GQ 2008, Verification of Drop Impact Simulations Using High-Speed Camera Measurements. in Wipiejewski, T. & Trewhella, J. (eds), 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA. IEEE, Orlando, FL, USA, pp. 2149-2155, 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA, 27/05/08.

Verification of Drop Impact Simulations Using High-Speed Camera Measurements. / Zaal, JJM; van Driel, WD; Kessels, FJHG et al.
2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA. ed. / Wipiejewski, T.; Trewhella, J. Orlando, FL, USA: IEEE, 2008. p. 2149-2155.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

TY - GEN

T1 - Verification of Drop Impact Simulations Using High-Speed Camera Measurements

AU - Zaal, JJM

AU - van Driel, WD

AU - Kessels, FJHG

AU - Zhang, GQ

PY - 2008

Y1 - 2008

N2 - The increased use of mobile appliances in today's society has resulted in an increase of reliability issues related to drop performance. A common method to assess the drop performance is the JEDEC specified drop impact test [1]. In this research the solder loading is investigated by means of drop impact simulations and high-speed camera measurements. The measurements are used to enhance the simulations by tuning the damping parameters. This results in models that are replicating the drop impact amplitudes and are thereby capable of determining the critical solder joint.

AB - The increased use of mobile appliances in today's society has resulted in an increase of reliability issues related to drop performance. A common method to assess the drop performance is the JEDEC specified drop impact test [1]. In this research the solder loading is investigated by means of drop impact simulations and high-speed camera measurements. The measurements are used to enhance the simulations by tuning the damping parameters. This results in models that are replicating the drop impact amplitudes and are thereby capable of determining the critical solder joint.

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 978-1-4244-2231-9

SP - 2149

EP - 2155

BT - 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA

A2 - Wipiejewski, T., null

A2 - Trewhella, J., null

PB - IEEE

CY - Orlando, FL, USA

T2 - 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA

Y2 - 27 May 2008 through 30 May 2008

ER -