Vertical die crack stresses of Flip Chip induced in major package assembly processes

DG Yang, LJ Ernst, C van t Hof, MS Kiasat, ? et al

Research output: Contribution to journalArticleScientific

23 Citations (Scopus)
Original languageUndefined/Unknown
Pages (from-to)1533-1538
Number of pages6
JournalMicroelectronics Reliability
Publication statusPublished - 2000


  • ZX Int.klas.verslagjaar < 2002

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