Vertical integration of rf passive components in stacked wafer-level packages

M Bartek; SM Sinaga; JN Burghartz

Vertical integration of rf passive components in stacked wafer-level packages

M Bartek, SM Sinaga, JN Burghartz

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

2 Citations (Scopus)

Original language	Undefined/Unknown
Title of host publication	Proceedings of the 15th European microelectronics and packaging conference and exhibition, (EMPC2005)
Editors	s.n.
Place of Publication	s.l.
Publisher	IMAPS
Pages	190-194
Number of pages	5
Publication status	Published - 2005
Event	15th European microelectronics and packaging conference and exhibition, (EMPC2005),Brugge, Belgium - s.l. Duration: 12 Jun 2005 → 15 Jun 2005

Publication series

Name
Publisher	IMAPS

Conference

Conference	15th European microelectronics and packaging conference and exhibition, (EMPC2005),Brugge, Belgium
Period	12/06/05 → 15/06/05

Bibliographical note

Editor onbekend JH

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

@inproceedings{922e432edf2c400a8edcb2bbe05ea35f,

title = "Vertical integration of rf passive components in stacked wafer-level packages",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "M Bartek and SM Sinaga and JN Burghartz",

note = "Editor onbekend JH; 15th European microelectronics and packaging conference and exhibition, (EMPC2005),Brugge, Belgium ; Conference date: 12-06-2005 Through 15-06-2005",

year = "2005",

language = "Undefined/Unknown",

publisher = "IMAPS",

pages = "190--194",

editor = "s.n.",

booktitle = "Proceedings of the 15th European microelectronics and packaging conference and exhibition, (EMPC2005)",

}

Bartek, M, Sinaga, SM & Burghartz, JN 2005, Vertical integration of rf passive components in stacked wafer-level packages. in s.n. (ed.), Proceedings of the 15th European microelectronics and packaging conference and exhibition, (EMPC2005). IMAPS, s.l., pp. 190-194, 15th European microelectronics and packaging conference and exhibition, (EMPC2005),Brugge, Belgium, 12/06/05.

Vertical integration of rf passive components in stacked wafer-level packages. / Bartek, M; Sinaga, SM; Burghartz, JN.
Proceedings of the 15th European microelectronics and packaging conference and exhibition, (EMPC2005). ed. / s.n. s.l.: IMAPS, 2005. p. 190-194.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Vertical integration of rf passive components in stacked wafer-level packages

AU - Bartek, M

AU - Sinaga, SM

AU - Burghartz, JN

N1 - Editor onbekend JH

PY - 2005

Y1 - 2005

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

UR - http://hitec.ewi.tudelft.nl/data/artwork/publication/734615506.pdf

M3 - Conference contribution

SP - 190

EP - 194

BT - Proceedings of the 15th European microelectronics and packaging conference and exhibition, (EMPC2005)

A2 - s.n., null

PB - IMAPS

CY - s.l.

T2 - 15th European microelectronics and packaging conference and exhibition, (EMPC2005),Brugge, Belgium

Y2 - 12 June 2005 through 15 June 2005

ER -

Vertical integration of rf passive components in stacked wafer-level packages

Publication series

Conference

Bibliographical note

Keywords

Other files and links

Cite this