Vertical integration of rf passive components in stacked wafer-level packages

M Bartek, SM Sinaga, JN Burghartz

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

    Original languageUndefined/Unknown
    Title of host publicationProceedings of the 15th European microelectronics and packaging conference and exhibition, (EMPC2005)
    Editors s.n.
    Place of Publications.l.
    PublisherIMAPS
    Pages190-194
    Number of pages5
    Publication statusPublished - 2005
    Event15th European microelectronics and packaging conference and exhibition, (EMPC2005),Brugge, Belgium - s.l.
    Duration: 12 Jun 200515 Jun 2005

    Publication series

    Name
    PublisherIMAPS

    Conference

    Conference15th European microelectronics and packaging conference and exhibition, (EMPC2005),Brugge, Belgium
    Period12/06/0515/06/05

    Keywords

    • conference contrib. refereed
    • Conf.proc. > 3 pag

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