@inproceedings{57ac17af93db445284b81b7ff7b668e6,
title = "Virtual Prototyping based Design Optimization of the Substrate, Leadframe, and Flip Chip Package Families with Low-k Technology",
keywords = "conference contrib. refereed, Conf.proc. > 3 pag",
author = "{van Driel}, WD and AM Grech and T Hauck and I Schmadlak and X Zhang and S Orain",
year = "2006",
language = "Undefined/Unknown",
isbn = "1-4244-0272X",
publisher = "EuroSimE",
pages = "1--5",
editor = "{Ernst, L.J.} and {Zhang, G.Q.} and {Rodgers, P.} and {Marco, S.} and {Meuwissen, M.} and {Saint Leger, O. de}",
booktitle = "Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006",
note = "EuroSimE 2006 ; Conference date: 24-04-2006 Through 26-04-2006",
}