Virtual Prototyping based Design Optimization of the Substrate, Leadframe, and Flip Chip Package Families with Low-k Technology

WD van Driel; AM Grech; T Hauck; I Schmadlak; X Zhang; S Orain

Virtual Prototyping based Design Optimization of the Substrate, Leadframe, and Flip Chip Package Families with Low-k Technology

WD van Driel, AM Grech, T Hauck, I Schmadlak, X Zhang, S Orain

Dynamics of Micro and Nano Systems

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

7 Citations (Scopus)

Original language	Undefined/Unknown
Title of host publication	Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006
Editors	Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M., Saint Leger, O. de
Place of Publication	Como, Italy
Publisher	EuroSimE
Pages	1-5
Number of pages	5
ISBN (Print)	1-4244-0272X
Publication status	Published - 2006
Event	EuroSimE 2006: 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - Como, Italy Duration: 24 Apr 2006 → 26 Apr 2006 Conference number: 7

Publication series

Name
Publisher	EuroSimE

Conference

Conference	EuroSimE 2006
Country/Territory	Italy
City	Como
Period	24/04/06 → 26/04/06

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

van Driel, WD., Grech, AM., Hauck, T., Schmadlak, I., Zhang, X., & Orain, S. (2006). Virtual Prototyping based Design Optimization of the Substrate, Leadframe, and Flip Chip Package Families with Low-k Technology. In Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M., & Saint Leger, O. de (Eds.), Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006 (pp. 1-5). EuroSimE.

van Driel, WD ; Grech, AM ; Hauck, T et al. / Virtual Prototyping based Design Optimization of the Substrate, Leadframe, and Flip Chip Package Families with Low-k Technology. Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. editor / Ernst, L.J. ; Zhang, G.Q. ; Rodgers, P. ; Marco, S. ; Meuwissen, M. ; Saint Leger, O. de. Como, Italy : EuroSimE, 2006. pp. 1-5

@inproceedings{57ac17af93db445284b81b7ff7b668e6,

title = "Virtual Prototyping based Design Optimization of the Substrate, Leadframe, and Flip Chip Package Families with Low-k Technology",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "\{van Driel\}, WD and AM Grech and T Hauck and I Schmadlak and X Zhang and S Orain",

year = "2006",

language = "Undefined/Unknown",

isbn = "1-4244-0272X",

publisher = "EuroSimE",

pages = "1--5",

editor = "\{Ernst, L.J.\} and \{Zhang, G.Q.\} and \{Rodgers, P.\} and \{Marco, S.\} and \{Meuwissen, M.\} and \{Saint Leger, O. de\}",

booktitle = "Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006",

note = "EuroSimE 2006 ; Conference date: 24-04-2006 Through 26-04-2006",

}

van Driel, WD, Grech, AM, Hauck, T, Schmadlak, I, Zhang, X & Orain, S 2006, Virtual Prototyping based Design Optimization of the Substrate, Leadframe, and Flip Chip Package Families with Low-k Technology. in Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M. & Saint Leger, O. de (eds), Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. EuroSimE, Como, Italy, pp. 1-5, EuroSimE 2006, Como, Italy, 24/04/06.

Virtual Prototyping based Design Optimization of the Substrate, Leadframe, and Flip Chip Package Families with Low-k Technology. / van Driel, WD; Grech, AM; Hauck, T et al.
Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. ed. / Ernst, L.J.; Zhang, G.Q.; Rodgers, P.; Marco, S.; Meuwissen, M.; Saint Leger, O. de. Como, Italy: EuroSimE, 2006. p. 1-5.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Virtual Prototyping based Design Optimization of the Substrate, Leadframe, and Flip Chip Package Families with Low-k Technology

AU - van Driel, WD

AU - Grech, AM

AU - Hauck, T

AU - Schmadlak, I

AU - Zhang, X

AU - Orain, S

N1 - Conference code: 7

PY - 2006

Y1 - 2006

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

UR - https://www.scopus.com/pages/publications/33847097464

M3 - Conference contribution

SN - 1-4244-0272X

SP - 1

EP - 5

BT - Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006

A2 - Ernst, L.J., null

A2 - Zhang, G.Q., null

A2 - Rodgers, P., null

A2 - Marco, S., null

A2 - Meuwissen, M., null

A2 - Saint Leger, O. de, null

PB - EuroSimE

CY - Como, Italy

T2 - EuroSimE 2006

Y2 - 24 April 2006 through 26 April 2006

ER -

van Driel WD, Grech AM, Hauck T, Schmadlak I, Zhang X, Orain S. Virtual Prototyping based Design Optimization of the Substrate, Leadframe, and Flip Chip Package Families with Low-k Technology. In Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M., Saint Leger, O. de, editors, Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. Como, Italy: EuroSimE. 2006. p. 1-5

Virtual Prototyping based Design Optimization of the Substrate, Leadframe, and Flip Chip Package Families with Low-k Technology

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