Virtual qualification of moisture induced failures of advanced packages

MAJ van Gils, WD van Driel, GQ Zhang, HJL Bressers, RBR van Silfhout, XJ Fan, JHJ Jansen

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

12 Citations (Scopus)
Original languageUndefined/Unknown
Title of host publicationEuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems
EditorsLJ Ernst, GQ Zhang, P Rodgers, O de Saint Leger
Place of PublicationPiscataway
PublisherIEEE Society
Pages157-162
Number of pages6
ISBN (Print)0-7803-8420-2
Publication statusPublished - 2004
EventEuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems - Brussels, Belgium
Duration: 10 May 200412 May 2004

Publication series

Name
PublisherIEEE

Conference

ConferenceEuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems
CountryBelgium
CityBrussels
Period10/05/0412/05/04

Keywords

  • Conf.proc. > 3 pag

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