Virtual thermo-mechanical prototyping of electronic packaging - challenges in material characterization and modeling

G.Q. Zhang, AAO Tay, LJ Ernst, ? et al

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

13 Citations (Scopus)
Original languageUndefined/Unknown
Title of host publication51st electronic components and tecjnology conference, May 26 - June 1
Editors P Slota Jr., WJ Howell
Place of Publications.l.
PublisherIEEE Society
Pages1479-1486
Number of pages8
ISBN (Print)0-7803-7038-4
Publication statusPublished - 2001
Event51st electronic components and tecjnology conference - s.l.
Duration: 26 May 20011 Jun 2001

Publication series

Name
PublisherIEEE

Conference

Conference51st electronic components and tecjnology conference
Period26/05/011/06/01

Keywords

  • ZX Int.klas.verslagjaar < 2002

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