Wafer bonding with nanoprecision alignment for micro/nano systems

L Jiang, G Pandraud, PJ French, SM Spearing, M kraft

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

Original language	Undefined/Unknown
Title of host publication	Proceedings of Transducers 2007
Editors	s.n.
Place of Publication	Washington
Publisher	IEEE Society
Pages	2103-2106
Number of pages	4
ISBN (Print)	1-4244-0842-3
Publication status	Published - 2007
Event	International Solid-State Sensors, Actuators and Microsystems Conference, 2007. Transducers 2007, Lyon, France - Lyon, France Duration: 10 Jun 2007 → 14 Jun 2007

Name
Publisher	IEEE

Conference	International Solid-State Sensors, Actuators and Microsystems Conference, 2007. Transducers 2007, Lyon, France
Country/Territory	France
City	Lyon
Period	10/06/07 → 14/06/07

Keywords

@inproceedings{42bdc6d18a6743fb91272edaea1f1f3d,

title = "Wafer bonding with nanoprecision alignment for micro/nano systems",

keywords = "professional journal papers, Conf.proc. > 3 pag",

author = "L Jiang and G Pandraud and PJ French and SM Spearing and M kraft",

year = "2007",

language = "Undefined/Unknown",

isbn = "1-4244-0842-3",

publisher = "IEEE Society",

pages = "2103--2106",

editor = "s.n.",

booktitle = "Proceedings of Transducers 2007",

note = "null ; Conference date: 10-06-2007 Through 14-06-2007",

}

TY - GEN

T1 - Wafer bonding with nanoprecision alignment for micro/nano systems

AU - Jiang, L

AU - Pandraud, G

AU - French, PJ

AU - Spearing, SM

AU - kraft, M

PY - 2007

Y1 - 2007

KW - professional journal papers

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 1-4244-0842-3

SP - 2103

EP - 2106

BT - Proceedings of Transducers 2007

A2 - s.n., null

PB - IEEE Society

CY - Washington

Y2 - 10 June 2007 through 14 June 2007

ER -