Wafer-level chip-scale packaging for low-end RF products

M Bartek; G Zilber; D Teomin; A Polyakov; SM Sinaga; P Mendes; JN Burghartz

Wafer-level chip-scale packaging for low-end RF products

M Bartek, G Zilber, D Teomin, A Polyakov, SM Sinaga, P Mendes, JN Burghartz

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

3 Citations (Scopus)

Original language	Undefined/Unknown
Title of host publication	Digest of papers 2004 Topical meeting on silicon monolithic integrated circuits in RF systems
Editors	JD Cressler, J Papapolymerou
Place of Publication	Piscataway
Publisher	IEEE Society
Pages	41-44
Number of pages	4
ISBN (Print)	0-7803-8703-1
Publication status	Published - 2004
Event	Topical meeting on silicon monolithic integrated circuits in RF systems, Atlanta, USA - Piscataway Duration: 8 Sept 2004 → 10 Sept 2004

Publication series

Name
Publisher	IEEE

Conference

Conference	Topical meeting on silicon monolithic integrated circuits in RF systems, Atlanta, USA
Period	8/09/04 → 10/09/04

Bibliographical note

ed. is niet bekend

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

@inproceedings{df690c502c9f4f01b04e14edcfff4633,

title = "Wafer-level chip-scale packaging for low-end RF products",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "M Bartek and G Zilber and D Teomin and A Polyakov and SM Sinaga and P Mendes and JN Burghartz",

note = "ed. is niet bekend; Topical meeting on silicon monolithic integrated circuits in RF systems, Atlanta, USA ; Conference date: 08-09-2004 Through 10-09-2004",

year = "2004",

language = "Undefined/Unknown",

isbn = "0-7803-8703-1",

publisher = "IEEE Society",

pages = "41--44",

editor = "JD Cressler and J Papapolymerou",

booktitle = "Digest of papers 2004 Topical meeting on silicon monolithic integrated circuits in RF systems",

}

Bartek, M, Zilber, G, Teomin, D, Polyakov, A, Sinaga, SM, Mendes, P & Burghartz, JN 2004, Wafer-level chip-scale packaging for low-end RF products. in JD Cressler & J Papapolymerou (eds), Digest of papers 2004 Topical meeting on silicon monolithic integrated circuits in RF systems. IEEE Society, Piscataway, pp. 41-44, Topical meeting on silicon monolithic integrated circuits in RF systems, Atlanta, USA, 8/09/04.

Wafer-level chip-scale packaging for low-end RF products. / Bartek, M; Zilber, G; Teomin, D et al.
Digest of papers 2004 Topical meeting on silicon monolithic integrated circuits in RF systems. ed. / JD Cressler; J Papapolymerou. Piscataway: IEEE Society, 2004. p. 41-44.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Wafer-level chip-scale packaging for low-end RF products

AU - Bartek, M

AU - Zilber, G

AU - Teomin, D

AU - Polyakov, A

AU - Sinaga, SM

AU - Mendes, P

AU - Burghartz, JN

N1 - ed. is niet bekend

PY - 2004

Y1 - 2004

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 0-7803-8703-1

SP - 41

EP - 44

BT - Digest of papers 2004 Topical meeting on silicon monolithic integrated circuits in RF systems

A2 - Cressler, JD

A2 - Papapolymerou, J

PB - IEEE Society

CY - Piscataway

T2 - Topical meeting on silicon monolithic integrated circuits in RF systems, Atlanta, USA

Y2 - 8 September 2004 through 10 September 2004

ER -