Wafer-level chip-scale packaging for RF applications

A Poliakov, M Bartek, JN Burghartz

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	SAFE 2002 Proceedings of 5th Semiconductor Advances for Future Electronics Workshop
Place of Publication	Utrecht
Publisher	STW Technology Foundation
Pages	87-90
Number of pages	4
ISBN (Print)	90-73461-33-2
Publication status	Published - 2002
Event	SAFE, Veldhoven, NL - Utrecht Duration: 27 Nov 2002 → 28 Nov 2002

Name
Publisher	STW Technology Foundation

Conference	SAFE, Veldhoven, NL
Period	27/11/02 → 28/11/02

CD-ROM

Keywords

@inproceedings{12bb2feb54c843adbeeade01f2f85d24,

title = "Wafer-level chip-scale packaging for RF applications",

keywords = "Conf.proc. > 3 pag",

author = "A Poliakov and M Bartek and JN Burghartz",

note = "CD-ROM; SAFE, Veldhoven, NL ; Conference date: 27-11-2002 Through 28-11-2002",

year = "2002",

language = "Undefined/Unknown",

isbn = "90-73461-33-2",

publisher = "STW Technology Foundation",

pages = "87--90",

booktitle = "SAFE 2002 Proceedings of 5th Semiconductor Advances for Future Electronics Workshop",

}

TY - GEN

T1 - Wafer-level chip-scale packaging for RF applications

AU - Poliakov, A

AU - Bartek, M

AU - Burghartz, JN

N1 - CD-ROM

PY - 2002

Y1 - 2002

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 90-73461-33-2

SP - 87

EP - 90

BT - SAFE 2002 Proceedings of 5th Semiconductor Advances for Future Electronics Workshop

PB - STW Technology Foundation

CY - Utrecht

T2 - SAFE, Veldhoven, NL

Y2 - 27 November 2002 through 28 November 2002

ER -