Wafer-level chip-scale packing for RF applications

A Poliakov, M Bartek, JN Burghartz

    Research output: Book/Report › Report › Professional

    Original languageUndefined/Unknown
    Place of PublicationDelft
    PublisherECTM Laboratory
    Number of pages15
    VolumeProgress report
    Publication statusPublished - 2002

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    PublisherECTM Laboratory

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