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Wafer-level direct bonding of optimized superconducting NbN for 3D chip integration
Ye Li, Amir Mirza Gheytaghi*, Miki Trifunovic, Yuanxing Xu, Guo Qi Zhang, Ryoichi Ishihara
*Corresponding author for this work
Research output: Contribution to journal › Article › Scientific › peer-review
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