Wafer Level Encapsulation Techniques for a MEMS Microreactor with integrated Heat Exchanger

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

1 Citation (Scopus)

Original language	English
Title of host publication	Proceedings of IEEE Sensors 2009 Conference
Publisher	IEEE
Pages	799-802
Number of pages	4
ISBN (Print)	978-1-4244-5225-1
Publication status	Published - 2009
Event	IEEE Sensors 2009 Conference - Christchurch, New Zealand Duration: 25 Oct 2009 → 28 Oct 2009

Cite this

@inproceedings{c16e6cb4f70c4511840a74b735d5042f,

title = "Wafer Level Encapsulation Techniques for a MEMS Microreactor with integrated Heat Exchanger",

author = "F Santagata and L Mele and M Mihailovic and B Morana and JF Creemer and PM Sarro",

year = "2009",

language = "English",

isbn = "978-1-4244-5225-1",

pages = "799--802",

booktitle = "Proceedings of IEEE Sensors 2009 Conference",

publisher = "IEEE",

address = "United States",

note = "IEEE Sensors 2009 Conference ; Conference date: 25-10-2009 Through 28-10-2009",

}

TY - GEN

T1 - Wafer Level Encapsulation Techniques for a MEMS Microreactor with integrated Heat Exchanger

AU - Santagata, F

AU - Mele, L

AU - Mihailovic, M

AU - Morana, B

AU - Creemer, JF

AU - Sarro, PM

PY - 2009

Y1 - 2009

M3 - Conference contribution

SN - 978-1-4244-5225-1

SP - 799

EP - 802

BT - Proceedings of IEEE Sensors 2009 Conference

PB - IEEE

T2 - IEEE Sensors 2009 Conference

Y2 - 25 October 2009 through 28 October 2009

ER -