Wafer-level packaging for RF applications using high-resistivity polycrystalline silicon substrate technology

A Polyakov; SM Sinaga; M Bartek; JN Burghartz

Wafer-level packaging for RF applications using high-resistivity polycrystalline silicon substrate technology

A Polyakov, SM Sinaga, M Bartek, JN Burghartz

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	Proceedings IMAPS 2004 - 37th Annual Symposium on Microelectronics
Place of Publication	Washington
Publisher	IMAPS
Pages	1-8
Number of pages	8
ISBN (Print)	0-930815-74-2
Publication status	Published - 2004
Event	IMAPS 2004 - 37th Annual Symposium on Microelectronics, Long Beach, USA - Washington Duration: 14 Nov 2004 → 18 Nov 2004

Publication series

Name
Publisher	IMAPS

Conference

Conference	IMAPS 2004 - 37th Annual Symposium on Microelectronics, Long Beach, USA
Period	14/11/04 → 18/11/04

Bibliographical note

ed. is niet bekend

Keywords

Elektrotechniek
conference contrib. refereed
Conf.proc. > 3 pag

Cite this

@inproceedings{0fa0c35ba7de494ebb41ce695eb46c88,

title = "Wafer-level packaging for RF applications using high-resistivity polycrystalline silicon substrate technology",

keywords = "Elektrotechniek, conference contrib. refereed, Conf.proc. > 3 pag",

author = "A Polyakov and SM Sinaga and M Bartek and JN Burghartz",

note = "ed. is niet bekend; null ; Conference date: 14-11-2004 Through 18-11-2004",

year = "2004",

language = "Undefined/Unknown",

isbn = "0-930815-74-2",

publisher = "IMAPS",

pages = "1--8",

booktitle = "Proceedings IMAPS 2004 - 37th Annual Symposium on Microelectronics",

}

Wafer-level packaging for RF applications using high-resistivity polycrystalline silicon substrate technology. / Polyakov, A; Sinaga, SM; Bartek, M et al.

Proceedings IMAPS 2004 - 37th Annual Symposium on Microelectronics. Washington : IMAPS, 2004. p. 1-8.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Wafer-level packaging for RF applications using high-resistivity polycrystalline silicon substrate technology

AU - Polyakov, A

AU - Sinaga, SM

AU - Bartek, M

AU - Burghartz, JN

N1 - ed. is niet bekend

PY - 2004

Y1 - 2004

KW - Elektrotechniek

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 0-930815-74-2

SP - 1

EP - 8

BT - Proceedings IMAPS 2004 - 37th Annual Symposium on Microelectronics

PB - IMAPS

CY - Washington

Y2 - 14 November 2004 through 18 November 2004

ER -