Wafer-Level Packaging Technology for RF Applications Based on a Rigid Low-Loss Spacer Substrate

A Poliakov

    Research output: ThesisDissertation (TU Delft)

    Original languageUndefined/Unknown
    QualificationDoctor of Philosophy
    Awarding Institution
    • Delft University of Technology
    • Burghartz, JN, Supervisor
    • Bartek, Marian, Advisor
    Award date16 Oct 2006
    Place of PublicationDelft
    Print ISBNs90-9021110-1
    Publication statusPublished - 2006


    • Elektrotechniek
    • authored books
    • Diss. prom. aan TU Delft

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