Wafer-level PECVD sic micropackaging technology for MEMS devices

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

Original language	Undefined/Unknown
Title of host publication	Wafer-level PECVD sic micropackaging technology for MEMS devices
Editors	s.n.
Place of Publication	zeist, the netherlands
Publisher	STW
Pages	1-4
Number of pages	4
ISBN (Print)	978-90-74702-55-3
Publication status	Published - 2009
Event	Sense of contact 11 - zeist, the netherlands Duration: 8 Apr 2009 → 8 Apr 2009

Name
Publisher	STW

Conference	Sense of contact 11
Period	8/04/09 → 8/04/09

Keywords

@inproceedings{6512669d06774c6b8160020059c6bb57,

title = "Wafer-level PECVD sic micropackaging technology for MEMS devices",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "V Rajaraman and PJ French",

year = "2009",

language = "Undefined/Unknown",

isbn = "978-90-74702-55-3",

publisher = "STW",

pages = "1--4",

editor = "s.n.",

booktitle = "Wafer-level PECVD sic micropackaging technology for MEMS devices",

note = "Sense of contact 11 ; Conference date: 08-04-2009 Through 08-04-2009",

}

TY - GEN

T1 - Wafer-level PECVD sic micropackaging technology for MEMS devices

AU - Rajaraman, V

AU - French, PJ

PY - 2009

Y1 - 2009

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 978-90-74702-55-3

SP - 1

EP - 4

BT - Wafer-level PECVD sic micropackaging technology for MEMS devices

A2 - s.n., null

PB - STW

CY - zeist, the netherlands

T2 - Sense of contact 11

Y2 - 8 April 2009 through 8 April 2009

ER -