Wafer-level PECVD sic micropackaging technology for MEMS devices

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

Original language	Undefined/Unknown
Title of host publication	Wafer-level PECVD sic micropackaging technology for MEMS devices
Editors	s.n.
Place of Publication	zeist, the netherlands
Publisher	STW
Pages	1-4
Number of pages	4
Publication status	Published - 2009

Name
Publisher	STW

Keywords

@inproceedings{e8669b52241743c8a842a5014666b229,

title = "Wafer-level PECVD sic micropackaging technology for MEMS devices",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "V Rajaraman and PJ French",

year = "2009",

language = "Undefined/Unknown",

publisher = "STW",

pages = "1--4",

editor = "s.n.",

booktitle = "Wafer-level PECVD sic micropackaging technology for MEMS devices",

}