Wafer Level Through Polymer Optical Vias (TPOV) Enabling High Throughput of Optical Windows Manufacturing

Z.Q. Huang, R.H. Poelma, Sten Vollebregt, M.H. Koelink, E. Boschman, R. Kropf, M. Gallouch, G.Q. Zhang

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

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Abstract

This article shows the fabrication process and packaging of through polymer optical vias (TPOV). The TPOV enables encapsulation and packaging of silicon photonic systems using film assisted molding (FAM) and the creation of micron-sized through polymer optical vias. The optical vias are lithographically defined in thick film photo-resist (∼ 300 μm) and parallel processed on substrate level. Placing and connecting optical windows on individual chips using pick & place is a difficult and time-consuming process because of the stringent requirements on alignment accuracy, cost and throughput. In this work we provide a solution to this problem by combining microfabrication technology with back-end film assisted molding technology for a new packaging approach for the integration of optical windows. As feasibility study we show through polymer optical windows on optical encoder Si photodiode arrays. The resulting microstructures are transparent in the spectrum of interest and hence serve as optical windows towards the substrate. Furthermore, our results show that the high aspect ratio (5:1) micro structure windows can be achieved and protected using FAM-technology. The optical through package windows are accurately defined (±5 μm accuracy due to mask limitations) and can significantly improve the throughput. The total process time of a single wafer with up to 1260 chips and 20160 windows, including lamination, exposure and development, would approximately take 1-1.5 hours.
Original languageEnglish
Title of host publication2018 7th Electronic System-Integration Technology Conference (ESTC)
PublisherIEEE
Pages1-5
Number of pages5
ISBN (Electronic)978-1-5386-6814-6
ISBN (Print)978-1-5386-6815-3
DOIs
Publication statusPublished - 2018
Event2018 7th Electronic System-Integration Technology Conference (ESTC) - Dresden, Germany
Duration: 18 Sep 201821 Sep 2018
Conference number: 7th

Conference

Conference2018 7th Electronic System-Integration Technology Conference (ESTC)
Abbreviated titleESTC 2018
CountryGermany
CityDresden
Period18/09/1821/09/18

Keywords

  • wafer level packaging
  • trhough polymer optical vias(TPOV)
  • micro optical windows

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