Wafer Scale Flexible Interconnect Transfer for Hetrogeneous Integration

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Abstract

A polymer-based wafer level integration technology suitable for miniaturized and multi-functional systems integration was developed and demonstrated in this work. Wafer scale flexible interconnects were firstly fabricated on one wafer, and then transferred to another wafer. Such transfer process involved wafer bonding and application of sacrificial materials. A sacrificial layer was firstly placed on the surface of the transfer wafer, and the sandwich interconnect structures were then manufactured on top of the sacrificial layer. With the help of the sacrificial layer, the flexible interconnects were transferred to another wafer through wafer bonding process. Contact resistance structures were fabricated with the help of wafer bonding process, connecting and aligning metal contact layer on device wafer and metal layer embedded in transferred flexible interconnects. Such transferred contact resistance was measured through designed testing structures as a demo for wafer level heterogeneous integration.

Original languageEnglish
Title of host publication2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
Subtitle of host publicationProceedings
EditorsL. O'Conner
Place of PublicationPiscataway
PublisherIEEE
Pages817-823
Number of pages7
ISBN (Electronic)978-1-7281-6180-8
ISBN (Print)978-1-7281-6181-5
DOIs
Publication statusPublished - 2020
Event70th IEEE Electronic Components and Technology Conference, ECTC 2020 - Orlando, United States
Duration: 3 Jun 202030 Jun 2020

Conference

Conference70th IEEE Electronic Components and Technology Conference, ECTC 2020
CountryUnited States
CityOrlando
Period3/06/2030/06/20

Keywords

  • flexible interconnect
  • heterogeneous integration
  • transferred interconnect

Fingerprint Dive into the research topics of 'Wafer Scale Flexible Interconnect Transfer for Hetrogeneous Integration'. Together they form a unique fingerprint.

  • Cite this

    Liu, P., Li, J., van Zeijl, H., & Zhang, G. (2020). Wafer Scale Flexible Interconnect Transfer for Hetrogeneous Integration. In L. O'Conner (Ed.), 2020 IEEE 70th Electronic Components and Technology Conference (ECTC): Proceedings (pp. 817-823). [9159329] IEEE. https://doi.org/10.1109/ECTC32862.2020.00133