Wafer-Scale Integration for Semi-Flexible Neural Implant Miniaturization

Marta Kluba, Bruno Morana, Angel Savov, Henk van Zeijl, Gregory Pandraud, Ronald Dekker

Research output: Contribution to journalArticleScientificpeer-review

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We present a novel, wafer-based fabrication process that enables integration and assembly of electronic components, such as ASICs and decoupling capacitors, with flexible interconnects. The electronic components are fabricated in, or placed on precisely defined and closely-spaced silicon islands that are connected by interconnects embedded in parylene-based flexible thin film. This fully CMOS compatible approach uses optimized DRIE processes and an SiO2 mesh-shaped mask, allowing for the simultaneous definition of micrometer- to millimeter-sized structures without compromising the flexibility of the device. In a single fabrication flow a unique freedom in dimensions of both the flexible film and the silicon islands can be achieved making this new technique ideal for the realization of semi-flexible/foldable implantable devices, where structures of different sizes have to be combined together for the ultimate miniaturization.
Original languageEnglish
Article number941
Number of pages5
Issue number13
Publication statusPublished - 2018


  • electroceuticals
  • implantables
  • miniaturization
  • integration
  • flexible interconnect
  • DRIE


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