Wafer thinning for high-density, through-wafer interconnects

L Wang; CCG Visser; CR de Boer; JMW Laros; W van der Vlist; J Groeneweg; G Craciun; PM Sarro

Wafer thinning for high-density, through-wafer interconnects

L Wang, CCG Visser, CR de Boer, JMW Laros, W van der Vlist, J Groeneweg, G Craciun, PM Sarro

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

3 Citations (Scopus)

Original language	Undefined/Unknown
Title of host publication	Proceedings of SPIE. Vol. 4979; micromachining and microfabrication process technnology VIII
Editors	JA Yasaitis, MA Perez-Maher, JM Karam
Place of Publication	Bellingham, USA
Publisher	The International Society for Optical Engineering
Pages	532-539
Number of pages	8
ISBN (Print)	0-8194-4779-X
Publication status	Published - 2003
Event	Micromachining and microfabrication process technology VIII, San Jose, CA. USA - Bellingham, USA Duration: 27 Jan 2003 → 29 Jan 2003

Publication series

Name
Publisher	The International Society for Optical Enginering

Name
Volume	4979

Conference

Conference	Micromachining and microfabrication process technology VIII, San Jose, CA. USA
Period	27/01/03 → 29/01/03

Keywords

Conf.proc. > 3 pag

Cite this

Wang, L., Visser, CCG., de Boer, CR., Laros, JMW., van der Vlist, W., Groeneweg, J., Craciun, G., & Sarro, PM. (2003). Wafer thinning for high-density, through-wafer interconnects. In JA. Yasaitis, MA. Perez-Maher, & JM. Karam (Eds.), Proceedings of SPIE. Vol. 4979; micromachining and microfabrication process technnology VIII (pp. 532-539). The International Society for Optical Engineering.

@inproceedings{3e83d42ba8b54762a66ff786d15195aa,

title = "Wafer thinning for high-density, through-wafer interconnects",

keywords = "Conf.proc. > 3 pag",

author = "L Wang and CCG Visser and {de Boer}, CR and JMW Laros and {van der Vlist}, W and J Groeneweg and G Craciun and PM Sarro",

year = "2003",

language = "Undefined/Unknown",

isbn = "0-8194-4779-X",

publisher = "The International Society for Optical Engineering",

pages = "532--539",

editor = "JA Yasaitis and MA Perez-Maher and JM Karam",

booktitle = "Proceedings of SPIE. Vol. 4979; micromachining and microfabrication process technnology VIII",

note = "Micromachining and microfabrication process technology VIII, San Jose, CA. USA ; Conference date: 27-01-2003 Through 29-01-2003",

}

Wang, L, Visser, CCG, de Boer, CR , Laros, JMW, van der Vlist, W, Groeneweg, J, Craciun, G & Sarro, PM 2003, Wafer thinning for high-density, through-wafer interconnects. in JA Yasaitis, MA Perez-Maher & JM Karam (eds), Proceedings of SPIE. Vol. 4979; micromachining and microfabrication process technnology VIII. The International Society for Optical Engineering, Bellingham, USA, pp. 532-539, Micromachining and microfabrication process technology VIII, San Jose, CA. USA, 27/01/03.

Wafer thinning for high-density, through-wafer interconnects. / Wang, L; Visser, CCG; de Boer, CR et al.
Proceedings of SPIE. Vol. 4979; micromachining and microfabrication process technnology VIII. ed. / JA Yasaitis; MA Perez-Maher; JM Karam. Bellingham, USA: The International Society for Optical Engineering, 2003. p. 532-539.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Wafer thinning for high-density, through-wafer interconnects

AU - Wang, L

AU - Visser, CCG

AU - de Boer, CR

AU - Laros, JMW

AU - van der Vlist, W

AU - Groeneweg, J

AU - Craciun, G

AU - Sarro, PM

PY - 2003

Y1 - 2003

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 0-8194-4779-X

SP - 532

EP - 539

BT - Proceedings of SPIE. Vol. 4979; micromachining and microfabrication process technnology VIII

A2 - Yasaitis, JA

A2 - Perez-Maher, MA

A2 - Karam, JM

PB - The International Society for Optical Engineering

CY - Bellingham, USA

T2 - Micromachining and microfabrication process technology VIII, San Jose, CA. USA

Y2 - 27 January 2003 through 29 January 2003

ER -

Wang L, Visser CCG, de Boer CR , Laros JMW, van der Vlist W, Groeneweg J et al. Wafer thinning for high-density, through-wafer interconnects. In Yasaitis JA, Perez-Maher MA, Karam JM, editors, Proceedings of SPIE. Vol. 4979; micromachining and microfabrication process technnology VIII. Bellingham, USA: The International Society for Optical Engineering. 2003. p. 532-539