Wafer thinning for high-density, through-wafer interconnects

L Wang, CCG Visser, CR de Boer, JMW Laros, W van der Vlist, J Groeneweg, G Craciun, PM Sarro

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

3 Citations (Scopus)
Original languageUndefined/Unknown
Title of host publicationProceedings of SPIE. Vol. 4979; micromachining and microfabrication process technnology VIII
EditorsJA Yasaitis, MA Perez-Maher, JM Karam
Place of PublicationBellingham, USA
PublisherThe International Society for Optical Enginering
Pages532-539
Number of pages8
ISBN (Print)0-8194-4779-X
Publication statusPublished - 2003
EventMicromachining and microfabrication process technology VIII, San Jose, CA. USA - Bellingham, USA
Duration: 27 Jan 200329 Jan 2003

Publication series

Name
PublisherThe International Society for Optical Enginering
Name
Volume4979

Conference

ConferenceMicromachining and microfabrication process technology VIII, San Jose, CA. USA
Period27/01/0329/01/03

Keywords

  • Conf.proc. > 3 pag

Cite this