Wafer thinning for highly dense 3D electronic structures

L Wang, PM Sarro

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Original languageUndefined/Unknown
Title of host publicationSAFE/ProRISC 2001: proceedings CD-ROM
Place of PublicationUtrecht
PublisherSTW Technology Foundation
Pages214-219
Number of pages6
ISBN (Print)90-73461-29-4
Publication statusPublished - 2001
EventSemiconductor Advances for Future Electronics - Program for Research on Integrated Systems and Circuits - Semiconductor Sensor and Actuator Technology, Veldhoven - Utrecht
Duration: 28 Nov 200130 Nov 2001

Publication series

Name
PublisherSTW technology foundation

Conference

ConferenceSemiconductor Advances for Future Electronics - Program for Research on Integrated Systems and Circuits - Semiconductor Sensor and Actuator Technology, Veldhoven
Period28/11/0130/11/01

Keywords

  • ZX Int.klas.verslagjaar < 2002

Cite this

Wang, L., & Sarro, PM. (2001). Wafer thinning for highly dense 3D electronic structures. In SAFE/ProRISC 2001: proceedings CD-ROM (pp. 214-219). STW Technology Foundation.