Warpage estimation of a multilayer package including cure shrinkage effects

Research output: Contribution to journal › Article › Scientific › peer-review

Original language	English
Pages (from-to)	459-466
Number of pages	8
Journal	IEEE Transactions on Components, Packaging and Manufacturing Technology
Volume	3
Issue number	3
DOIs	https://doi.org/10.1109/TCPMT.2013.2243497
Publication status	Published - 2013

Keywords

@article{b25808150e7542e4a8904f263d9a2c5d,

title = "Warpage estimation of a multilayer package including cure shrinkage effects",

keywords = "CWTS JFIS < 0.75",

author = "KMB Jansen and B Ozturk",

year = "2013",

doi = "10.1109/TCPMT.2013.2243497",

language = "English",

volume = "3",

pages = "459--466",

journal = "IEEE Transactions on Components, Packaging and Manufacturing Technology",

issn = "1521-3323",

publisher = "Institute of Electrical and Electronics Engineers (IEEE)",

number = "3",

}

TY - JOUR

T1 - Warpage estimation of a multilayer package including cure shrinkage effects

AU - Jansen, KMB

AU - Ozturk, B

PY - 2013

Y1 - 2013

KW - CWTS JFIS < 0.75

U2 - 10.1109/TCPMT.2013.2243497

DO - 10.1109/TCPMT.2013.2243497

M3 - Article

SN - 1521-3323

VL - 3

SP - 459

EP - 466

JO - IEEE Transactions on Components, Packaging and Manufacturing Technology

JF - IEEE Transactions on Components, Packaging and Manufacturing Technology

IS - 3

ER -