Wire bonding the future: a combined experimental and numerical approach to improve the Cu-wire bonding quality

E Spaan, E Ooms, WD van Driel, CA Yuan, D Yang, GQ Zhang

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

7 Citations (Scopus)

Abstract

In this paper, the Copper wirebonding technology is investigated. From a numerical point of view, the wirebonding process is modelled. Experiments on specially designed bondpads are performed in order to verify the models. As such, this leads to a thorough understanding of the wirebonding process, especially the forces that take a role during this process.
Original languageEnglish
Title of host publicationProceedings of the 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, 26-28 April 2010, Bordeaux, France
Editors Ernst, LJ, Zhang, GQ, Driel, WD van, Rodgers, P, Bailey, C, Saint Leger, O de
Place of PublicationBordeaux, France
PublisherIEEE Society
Pages1-4
Number of pages4
ISBN (Print)978-1-4244-7025-9
Publication statusPublished - 2010
EventEuroSimE 2010 : 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems - Bordeaux, Frankrijk, Bordeaux, France
Duration: 25 Apr 201028 Apr 2010
Conference number: 11

Publication series

Name
PublisherIEEE

Conference

ConferenceEuroSimE 2010 
CountryFrance
CityBordeaux
Period25/04/1028/04/10

Keywords

  • conference contrib. refereed
  • Conf.proc. > 3 pag

Fingerprint Dive into the research topics of 'Wire bonding the future: a combined experimental and numerical approach to improve the Cu-wire bonding quality'. Together they form a unique fingerprint.

  • Cite this

    Spaan, E., Ooms, E., van Driel, WD., Yuan, CA., Yang, D., & Zhang, GQ. (2010). Wire bonding the future: a combined experimental and numerical approach to improve the Cu-wire bonding quality. In Ernst, LJ, Zhang, GQ, Driel, WD van, Rodgers, P, Bailey, C, & Saint Leger, O de (Eds.), Proceedings of the 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, 26-28 April 2010, Bordeaux, France (pp. 1-4). IEEE Society.