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  • Foreword/postscript

    Welcome address from the technical programme co-chairs

    Gomes, L., Palensky, P. & Al-Haddad, K., 3 Aug 2017, Proceedings of IEEE International Symposium on Industrial Electronics (ISIE): The 26th International Symposium. Piscataway, NJ: IEEE, p. 3-4 2 p.

    Research output: Chapter in Book/Conference proceedings/Edited volume › Foreword/postscript › Scientific

  • Welcome from the chairs

    Vanderose, B., Frenay, B., Henry, J. & Devroey, X., 26 Aug 2019, EASEAI 2019 - Proceedings of the 1st ACM SIGSOFT International Workshop on Education through Advanced Software Engineering and Artificial Intelligence, co-located with ESEC/FSE 2019. Vanderose, B., Frenay, B., Henry, B. & Henry, X. (eds.). p. III (EASEAI 2019 - Proceedings of the 1st ACM SIGSOFT International Workshop on Education through Advanced Software Engineering and Artificial Intelligence, co-located with ESEC/FSE 2019).

    Research output: Chapter in Book/Conference proceedings/Edited volume › Foreword/postscript › Scientific

  • Welcome from the chairs

    Fontana, F. A., Perrouin, G., Ampatzoglou, A., Acher, M., Walter, B., Cordy, M., Palomba, F. & Devroey, X., 27 Aug 2019, MaLTeSQuE 2019 - Proceedings of the 3rd ACM SIGSOFT International Workshop on Machine Learning Techniques for Software Quality Evaluation, co-located with ESEC/FSE 2019. Fontana, F. A., Walter, B., Ampatzoglou, A., Palomba, F., Perrouin, G., Acher, M., Cordy, M. & Devroey, M. (eds.). p. III-IV (MaLTeSQuE 2019 - Proceedings of the 3rd ACM SIGSOFT International Workshop on Machine Learning Techniques for Software Quality Evaluation, co-located with ESEC/FSE 2019).

    Research output: Chapter in Book/Conference proceedings/Edited volume › Foreword/postscript › Scientific

  • Welcome from the Chairs

    Vanderose, B., Henry, J., Frenay, B. & Devroey, X., 2020, Proceedings of the 2nd ACM SIGSOFT International Workshop on Education through Advanced Software Engineering and Artificial Intelligence. p. III-IV (EASEAI 2020 - Proceedings of the 2nd ACM SIGSOFT International Workshop on Education through Advanced Software Engineering and Artificial Intelligence, Co-located with ESEC/FSE 2020).

    Research output: Chapter in Book/Conference proceedings/Edited volume › Foreword/postscript › Scientific

  • Welcome Message from the WCTI Workshop Organizers

    Doerr, C., 2018, ARES 2018: Proceedings of the 13th International Conference on Availability, Reliability and Security . New York, NY: Association for Computing Machinery (ACM), p. 129mDUMMY (ACM International Conference Proceeding Series).

    Research output: Chapter in Book/Conference proceedings/Edited volume › Foreword/postscript › Scientific

  • Welcome to DRS 2022

    Lockton, D., Lenzi, S. L., Hekkert, P. P. M., Oak, A., Sadaba, J. & Lloyd, P. A., 2022, Proceedings of DRS 2022: Design Research Society International Conference, Bilbao. Lockton, D., Lenzi, S., Hekkert, P., Oak, A., Sádaba, J. & Lloyd, P. (eds.). p. 2-4 (DRS International Biennial Conference Series).

    Research output: Chapter in Book/Conference proceedings/Edited volume › Foreword/postscript › Scientific

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  • Woord vooraf. Laat de feiten voor zich spreken

    Kroonenberg, SB., 2010, De staat van het klimaat. s.n. (ed.). Amsterdam: FMB Uitgevers, p. 11-14 333 p.

    Research output: Chapter in Book/Conference proceedings/Edited volume › Foreword/postscript › Professional

  • Writing Urban Places: The Training School on Local Stories, and the Story of the Home of EKA

    Havik, K. M., 2023, Proceedings 11-12 / 2023, Faculty of Architecture. Soolep, J., Ojari, A. & Tammet, T. (eds.). Tallinn: Estonian Academy of Arts Faculty of Architecture, p. 8-10 3 p.

    Research output: Chapter in Book/Conference proceedings/Edited volume › Foreword/postscript › Scientific

    Open Access
    File
    11 Downloads (Pure)