Abstract
The nano-copper particles are widely used in the sintering processes of packaging wide bandgap semiconductors. Despite the significant success in the industry, the mechanism bridging the sintering process to the mechanical properties of sintered nano-copper is not yet well-modeled. In this paper, the impacts of different sintering temperatures and initial porosities caused by different stacking patterns on the uniaxial tensile performance of the sintered layer were studied via a molecular dynamics approach. Two stacking patterns, simple cubic and face-centered cubic, were simulated, respectively. Evolution of their structure at temperatures of 300, 400, 500, and 600 K were simulated as the sintering process. Afterward, the sintered structures were subjected to uniaxial tensile with rates of 0.01 and 0.04 Å/ps at different temperatures to compare the mechanical properties. The results show that the sintering rate and density of the sintered structure increase with a higher temperature. However, the tensile strength of the sintered structure is less relevant to the difference in stacking pattern. This study proves that porosity has a greater effect on sintering quality.
Original language | English |
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Title of host publication | Proceedings of the 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
Publisher | IEEE |
Number of pages | 7 |
ISBN (Electronic) | 979-8-3503-9363-7 |
ISBN (Print) | 979-8-3503-9364-4 |
DOIs | |
Publication status | Published - 2024 |
Event | 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Catania, Italy Duration: 7 Apr 2024 → 10 Apr 2024 Conference number: 25th |
Publication series
Name | 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024 |
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Conference
Conference | 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
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Abbreviated title | EuriSimE 2024 |
Country/Territory | Italy |
City | Catania |
Period | 7/04/24 → 10/04/24 |
Bibliographical note
Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-careOtherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.
Keywords
- Nano-copper sintering
- molecular dynamics simulation
- particle packing model
- tensile simulation