A novel tool for cure dependent viscoelastic characterization of packaging polymers

C van t Hof; G Wisse; LJ Ernst; KMB Jansen; D Yang; GQ Zhang; HJL Bressers

A novel tool for cure dependent viscoelastic characterization of packaging polymers

C van t Hof, G Wisse, LJ Ernst, KMB Jansen, D Yang, GQ Zhang, HJL Bressers

Dynamics of Micro and Nano Systems

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

6 Citations (Scopus)

Original language	Undefined/Unknown
Title of host publication	EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems
Editors	LJ Ernst, GQ Zhang, P Rodgers, O de Saint Leger
Place of Publication	Piscataway
Publisher	IEEE
Pages	385-389
Number of pages	5
ISBN (Print)	0-7803-8420-2
Publication status	Published - 2004
Event	EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems - Brussels, Belgium Duration: 10 May 2004 → 12 May 2004

Publication series

Name
Publisher	IEEE

Conference

Conference	EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems
Country/Territory	Belgium
City	Brussels
Period	10/05/04 → 12/05/04

Bibliographical note

IEEE Cat No. 04EX831

Keywords

Conf.proc. > 3 pag

Cite this

van t Hof, C., Wisse, G., Ernst, LJ., Jansen, KMB., Yang, D., Zhang, GQ., & Bressers, HJL. (2004). A novel tool for cure dependent viscoelastic characterization of packaging polymers. In LJ. Ernst, GQ. Zhang, P. Rodgers, & O. de Saint Leger (Eds.), EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems (pp. 385-389). IEEE.

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author = "{van t Hof}, C and G Wisse and LJ Ernst and KMB Jansen and D Yang and GQ Zhang and HJL Bressers",

note = "IEEE Cat No. 04EX831; EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems ; Conference date: 10-05-2004 Through 12-05-2004",

year = "2004",

language = "Undefined/Unknown",

isbn = "0-7803-8420-2",

publisher = "IEEE",

pages = "385--389",

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booktitle = "EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems",

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van t Hof, C, Wisse, G, Ernst, LJ, Jansen, KMB, Yang, D, Zhang, GQ & Bressers, HJL 2004, A novel tool for cure dependent viscoelastic characterization of packaging polymers. in LJ Ernst, GQ Zhang, P Rodgers & O de Saint Leger (eds), EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems. IEEE, Piscataway, pp. 385-389, EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, Brussels, Belgium, 10/05/04.

A novel tool for cure dependent viscoelastic characterization of packaging polymers. / van t Hof, C; Wisse, G; Ernst, LJ et al.
EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems. ed. / LJ Ernst; GQ Zhang; P Rodgers; O de Saint Leger. Piscataway: IEEE, 2004. p. 385-389.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - A novel tool for cure dependent viscoelastic characterization of packaging polymers

AU - van t Hof, C

AU - Wisse, G

AU - Ernst, LJ

AU - Jansen, KMB

AU - Yang, D

AU - Zhang, GQ

AU - Bressers, HJL

N1 - IEEE Cat No. 04EX831

PY - 2004

Y1 - 2004

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 0-7803-8420-2

SP - 385

EP - 389

BT - EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems

A2 - Ernst, LJ

A2 - Zhang, GQ

A2 - Rodgers, P

A2 - de Saint Leger, O

PB - IEEE

CY - Piscataway

T2 - EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems

Y2 - 10 May 2004 through 12 May 2004

ER -

van t Hof C, Wisse G, Ernst LJ, Jansen KMB, Yang D, Zhang GQ et al. A novel tool for cure dependent viscoelastic characterization of packaging polymers. In Ernst LJ, Zhang GQ, Rodgers P, de Saint Leger O, editors, EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems. Piscataway: IEEE. 2004. p. 385-389