Analytical solution for moisture-induced interface delamination in electronic packaging

X Fan, GQ Zhang, W van Driel, LJ Ernst

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

34 Citations (Scopus)
Original languageUndefined/Unknown
Title of host publication53rd electronic components & technology conference
EditorsSK Sitaraman, M Lamson
Place of PublicationPiscataway
PublisherIEEE Society
Pages733-738
Number of pages6
ISBN (Print)0-7803-7991-5
Publication statusPublished - 2003
Event53rd electronic components & technology conference - New Orleans, United States
Duration: 27 May 200330 May 2003

Publication series

Name
PublisherIEEE

Conference

Conference53rd electronic components & technology conference
CountryUnited States
CityNew Orleans
Period27/05/0330/05/03

Keywords

  • Conf.proc. > 3 pag

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