Automatic process design for 3D thick-film grayscale photolithography

FCM van Kempen, Y Hirai, F van Keulen, O Tabata

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

4 Citations (Scopus)

Abstract

A novel process optimization tool for grayscale lithography is developed and demonstrated to fabricate three-dimensional (3D) microstructures using thick-film photoresists. For the first time, the two process parameters in grayscale lithography: exposure dose profile and development time are determined automatically for a user-specified target 3D profile. This provides an inexpensive and effective alternative to conventional trialand-error based process design. The optimized parameters were verified by fabricating various 3D microstructures and the experiments revealed good quantitative agreement with the target profile . KEYWORDS Grayscale Photolithography, 3D Microstructuring, Design Optimization, Automatic Process Design
Original languageEnglish
Title of host publicationProceedings of the 17th Conference on Solid-State Sensors, Actuators & Microsystems 2013
EditorsJR Morante, C Hierold
Place of PublicationPiscataway, NJ, USA
PublisherIEEE Society
Pages1625-1628
Number of pages4
ISBN (Print)978-1-4673-5983-2/13
DOIs
Publication statusPublished - 2013
EventTransducers 2013 & Eurosensors XXVII, Barcelona, Spain - Piscataway, NJ, USA
Duration: 16 Jun 201320 Jun 2013

Publication series

Name
PublisherIEEE

Conference

ConferenceTransducers 2013 & Eurosensors XXVII, Barcelona, Spain
Period16/06/1320/06/13

Keywords

  • Conf.proc. > 3 pag

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