Chip-on-flexible packaging for high-power flip-chip light-emitting diode by auSn and SAC soldering

Y Liu, J Zhao, CCA Yuan, GQ Zhang, F Sun

Research output: Contribution to journalArticleScientificpeer-review

19 Citations (Scopus)
Original languageEnglish
Pages (from-to)1754-1759
Number of pages6
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Issue number11
Publication statusPublished - 2014

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