Design, Experiment and Analysis of the Solder on Rubber (SOR) structure of WLCSP

CA Yuan; GQ Zhang; CS Huang; CH Yu; CC Yang; WK Yang; MC Yew; C Nan Han; KN Chiang

Design, Experiment and Analysis of the Solder on Rubber (SOR) structure of WLCSP

CA Yuan, GQ Zhang, CS Huang, CH Yu, CC Yang, WK Yang, MC Yew, C Nan Han, KN Chiang

Computational Design and Mechanics

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006
Editors	Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M., Saint Leger, O. de
Place of Publication	Como, Italy
Publisher	EuroSimE
Pages	1-7
Number of pages	7
ISBN (Print)	1-4244-0272X
Publication status	Published - 2006
Event	EuroSimE 2006: 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - Como, Italy Duration: 24 Apr 2006 → 26 Apr 2006 Conference number: 7

Publication series

Name
Publisher	EuroSimE

Conference

Conference	EuroSimE 2006
Country/Territory	Italy
City	Como
Period	24/04/06 → 26/04/06

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

Yuan, CA., Zhang, GQ., Huang, CS., Yu, CH., Yang, CC., Yang, WK., Yew, MC., Nan Han, C., & Chiang, KN. (2006). Design, Experiment and Analysis of the Solder on Rubber (SOR) structure of WLCSP. In Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M., & Saint Leger, O. de (Eds.), Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006 (pp. 1-7). EuroSimE.

Yuan, CA ; Zhang, GQ ; Huang, CS et al. / Design, Experiment and Analysis of the Solder on Rubber (SOR) structure of WLCSP. Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. editor / Ernst, L.J. ; Zhang, G.Q. ; Rodgers, P. ; Marco, S. ; Meuwissen, M. ; Saint Leger, O. de. Como, Italy : EuroSimE, 2006. pp. 1-7

@inproceedings{614b4a1146a04ed8ab39890a04f862f0,

title = "Design, Experiment and Analysis of the Solder on Rubber (SOR) structure of WLCSP",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "CA Yuan and GQ Zhang and CS Huang and CH Yu and CC Yang and WK Yang and MC Yew and {Nan Han}, C and KN Chiang",

year = "2006",

language = "Undefined/Unknown",

isbn = "1-4244-0272X",

publisher = "EuroSimE",

pages = "1--7",

editor = "{Ernst, L.J.} and {Zhang, G.Q.} and {Rodgers, P.} and {Marco, S.} and {Meuwissen, M.} and {Saint Leger, O. de}",

booktitle = "Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006",

note = "EuroSimE 2006 ; Conference date: 24-04-2006 Through 26-04-2006",

}

Yuan, CA, Zhang, GQ, Huang, CS, Yu, CH, Yang, CC, Yang, WK, Yew, MC, Nan Han, C & Chiang, KN 2006, Design, Experiment and Analysis of the Solder on Rubber (SOR) structure of WLCSP. in Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M. & Saint Leger, O. de (eds), Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. EuroSimE, Como, Italy, pp. 1-7, EuroSimE 2006, Como, Italy, 24/04/06.

Design, Experiment and Analysis of the Solder on Rubber (SOR) structure of WLCSP. / Yuan, CA; Zhang, GQ; Huang, CS et al.
Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. ed. / Ernst, L.J.; Zhang, G.Q.; Rodgers, P.; Marco, S.; Meuwissen, M.; Saint Leger, O. de. Como, Italy: EuroSimE, 2006. p. 1-7.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Design, Experiment and Analysis of the Solder on Rubber (SOR) structure of WLCSP

AU - Yuan, CA

AU - Zhang, GQ

AU - Huang, CS

AU - Yu, CH

AU - Yang, CC

AU - Yang, WK

AU - Yew, MC

AU - Nan Han, C

AU - Chiang, KN

N1 - Conference code: 7

PY - 2006

Y1 - 2006

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 1-4244-0272X

SP - 1

EP - 7

BT - Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006

A2 - Ernst, L.J., null

A2 - Zhang, G.Q., null

A2 - Rodgers, P., null

A2 - Marco, S., null

A2 - Meuwissen, M., null

A2 - Saint Leger, O. de, null

PB - EuroSimE

CY - Como, Italy

T2 - EuroSimE 2006

Y2 - 24 April 2006 through 26 April 2006

ER -

Yuan CA, Zhang GQ, Huang CS, Yu CH, Yang CC, Yang WK et al. Design, Experiment and Analysis of the Solder on Rubber (SOR) structure of WLCSP. In Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M., Saint Leger, O. de, editors, Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. Como, Italy: EuroSimE. 2006. p. 1-7