@inproceedings{995cceab5dde4d27a1e12d4ddc62debb,
title = "Effect of delamination of IC/compound interface on passivation cracking",
keywords = "Conf.proc. > 3 pag",
author = "{van Silfhout}, RBR and JD Roustant and {van Driel}, WD and Y. Li and GQ Zhang and D Yang",
year = "2003",
language = "Undefined/Unknown",
isbn = "0-7803-7054-6",
publisher = "IEEE Society",
pages = "353--358",
editor = "LJ Ernst and GQ Zhang and R Dudek and {de Saint Leger}, O",
booktitle = "Thermal & mechanical simulation and experiments in microelectronics and microsystems",
note = "EuroSimE 2003 ; Conference date: 30-03-2003 Through 02-04-2003",
}