Effect of filler size on complex permittivity and thermal conductivity of epoxy-based composites filled with BN particles

R Kochetov; T Andritsch; PHF Morshuis; JJ Smit

Effect of filler size on complex permittivity and thermal conductivity of epoxy-based composites filled with BN particles

R Kochetov, T Andritsch, PHF Morshuis, JJ Smit

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

17 Citations (Scopus)

Original language	English
Title of host publication	2010 IEEE Conference on Electrical Insulation and Dielectric Phenomena
Editors	s.n.
Place of Publication	West Lafayette, USA
Publisher	IEEE
Pages	534-537
Number of pages	4
ISBN (Print)	978-1-4244-9470-5
Publication status	Published - 2010
Event	CEIDP 2010, Conference on Electrical Insulation and Dielectric Phenomena - West Lafayette, USA Duration: 17 Oct 2010 → 20 Oct 2010

Publication series

Name
Publisher	IEEE

Conference

Conference	CEIDP 2010, Conference on Electrical Insulation and Dielectric Phenomena
Period	17/10/10 → 20/10/10

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

@inproceedings{1e069cfe2ba140adb3127cac3e12e66e,

title = "Effect of filler size on complex permittivity and thermal conductivity of epoxy-based composites filled with BN particles",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "R Kochetov and T Andritsch and PHF Morshuis and JJ Smit",

year = "2010",

language = "English",

isbn = "978-1-4244-9470-5",

publisher = "IEEE",

pages = "534--537",

editor = "s.n.",

booktitle = "2010 IEEE Conference on Electrical Insulation and Dielectric Phenomena",

address = "United States",

note = "CEIDP 2010, Conference on Electrical Insulation and Dielectric Phenomena ; Conference date: 17-10-2010 Through 20-10-2010",

}

Kochetov, R, Andritsch, T, Morshuis, PHF & Smit, JJ 2010, Effect of filler size on complex permittivity and thermal conductivity of epoxy-based composites filled with BN particles. in s.n. (ed.), 2010 IEEE Conference on Electrical Insulation and Dielectric Phenomena. IEEE, West Lafayette, USA, pp. 534-537, CEIDP 2010, Conference on Electrical Insulation and Dielectric Phenomena, 17/10/10.

Effect of filler size on complex permittivity and thermal conductivity of epoxy-based composites filled with BN particles. / Kochetov, R; Andritsch, T; Morshuis, PHF et al.
2010 IEEE Conference on Electrical Insulation and Dielectric Phenomena. ed. / s.n. West Lafayette, USA: IEEE, 2010. p. 534-537.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Effect of filler size on complex permittivity and thermal conductivity of epoxy-based composites filled with BN particles

AU - Kochetov, R

AU - Andritsch, T

AU - Morshuis, PHF

AU - Smit, JJ

PY - 2010

Y1 - 2010

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 978-1-4244-9470-5

SP - 534

EP - 537

BT - 2010 IEEE Conference on Electrical Insulation and Dielectric Phenomena

A2 - s.n., null

PB - IEEE

CY - West Lafayette, USA

T2 - CEIDP 2010, Conference on Electrical Insulation and Dielectric Phenomena

Y2 - 17 October 2010 through 20 October 2010

ER -