Electro-thermally activated polymeric stack for linear in-plane actuation

GK Lau, JFL Goosen, F van Keulen, T Chu Duc, PM Sarro

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

5 Citations (Scopus)

Abstract

An electrothermally-activated polymeric stacked actuator is presented to generate a rectilinear in-plane actuation. The actuator has a novel composite design, comprising of SU8 thermal expandable polymer, a silicon heat conductor and a top thin-film aluminium heater. The silicon heat conductor has a symmetric meandering shape. It extends through a thick SU8 layer. Theory and numerical analyses show that this design offers advantages of enhanced longitudinal thermal expansion and enhanced heat transfer across thickness of the insulating SU8 layer. It is effective in electromechanical actuation. An activated 530-micron long micro-machined thermal stack demonstrates a longitudinal stroke of 13 microns at 2V and 27mW, and a low temperature rise below 300 degrees Centigrade. Therefore, it can potentially be used for wider applications where low temperature and power efficiency are concerned.
Original languageUndefined/Unknown
Title of host publicationProceedings of the 5th IEEE Conference on Sensors
Editors Sukhan Lee, Masayoshi Esashi
PublisherIEEE Society
Pages538-541
Number of pages4
ISBN (Print)1-4244-0376-6
Publication statusPublished - 2006
EventIEEE Sensors 2006: 5th IEEE Conference on Sensors - Daegu, Korea, Republic of
Duration: 22 Oct 200625 Oct 2006
Conference number: 5

Publication series

Name
PublisherIEEE

Conference

ConferenceIEEE Sensors 2006
CountryKorea, Republic of
CityDaegu
Period22/10/0625/10/06

Keywords

  • conference contrib. refereed
  • Conf.proc. > 3 pag

Cite this

Lau, GK., Goosen, JFL., van Keulen, F., Chu Duc, T., & Sarro, PM. (2006). Electro-thermally activated polymeric stack for linear in-plane actuation. In Sukhan Lee, & Masayoshi Esashi (Eds.), Proceedings of the 5th IEEE Conference on Sensors (pp. 538-541). IEEE Society.