Electromigration-induced local dewetting in Cu films

Yaqian Zhang; Jiarui Mo; Zhen Cui; Sten Vollebregt; Guoqi Zhang

doi:10.1109/IITC/MAM57687.2023.10154761

Electromigration-induced local dewetting in Cu films

Yaqian Zhang, Jiarui Mo, Zhen Cui, Sten Vollebregt, Guoqi Zhang

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

2 Citations (Scopus)

44 Downloads (Pure)

Abstract

The continuous downscaling of microelectronics has introduced many reliability issues on interconnect. Electromigration and dewetting are major reliability concerns in high-temperature micro- and nanoscale devices. In this paper, the local dewetting of copper thin film during the electromigration test was first found and investigated. When the high current was applied, the dewetted copper forming around the edge was observed at the cathode of the conductor. Furthermore, the effect of temperature and conductor size on local dewetting was investigated. Our proposed mechanism for local dewetting is in good agreement with experimental findings.

Original language	English
Title of host publication	Proceedings of the 2023 IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference, IITC/MAM 2023
Place of Publication	Piscataway
Publisher	IEEE
Number of pages	4
ISBN (Electronic)	979-8-3503-1097-9
ISBN (Print)	979-8-3503-1098-6
DOIs	https://doi.org/10.1109/IITC/MAM57687.2023.10154761
Publication status	Published - 2023
Event	2023 IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference, IITC/MAM 2023 - Dresden, Germany Duration: 22 May 2023 → 25 May 2023

Conference

Conference	2023 IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference, IITC/MAM 2023
Country/Territory	Germany
City	Dresden
Period	22/05/23 → 25/05/23

Bibliographical note

Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care
Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

Keywords

Copper
Dewetting
Electromigration
Thin film

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10.1109/IITC/MAM57687.2023.10154761

Electromigration-induced_local_dewetting_in_Cu_filmsFinal published version, 1.75 MB

Cite this

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title = "Electromigration-induced local dewetting in Cu films",

abstract = "The continuous downscaling of microelectronics has introduced many reliability issues on interconnect. Electromigration and dewetting are major reliability concerns in high-temperature micro- and nanoscale devices. In this paper, the local dewetting of copper thin film during the electromigration test was first found and investigated. When the high current was applied, the dewetted copper forming around the edge was observed at the cathode of the conductor. Furthermore, the effect of temperature and conductor size on local dewetting was investigated. Our proposed mechanism for local dewetting is in good agreement with experimental findings.",

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author = "Yaqian Zhang and Jiarui Mo and Zhen Cui and Sten Vollebregt and Guoqi Zhang",

note = "Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.; 2023 IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference, IITC/MAM 2023 ; Conference date: 22-05-2023 Through 25-05-2023",

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Zhang, Y , Mo, J, Cui, Z, Vollebregt, S & Zhang, G 2023, Electromigration-induced local dewetting in Cu films. in Proceedings of the 2023 IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference, IITC/MAM 2023 . IEEE, Piscataway, 2023 IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference, IITC/MAM 2023, Dresden, Germany, 22/05/23. https://doi.org/10.1109/IITC/MAM57687.2023.10154761

Electromigration-induced local dewetting in Cu films. / Zhang, Yaqian ; Mo, Jiarui; Cui, Zhen et al.
Proceedings of the 2023 IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference, IITC/MAM 2023 . Piscataway: IEEE, 2023.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

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T1 - Electromigration-induced local dewetting in Cu films

AU - Zhang, Yaqian

AU - Mo, Jiarui

AU - Cui, Zhen

AU - Vollebregt, Sten

AU - Zhang, Guoqi

N1 - Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

PY - 2023

Y1 - 2023

N2 - The continuous downscaling of microelectronics has introduced many reliability issues on interconnect. Electromigration and dewetting are major reliability concerns in high-temperature micro- and nanoscale devices. In this paper, the local dewetting of copper thin film during the electromigration test was first found and investigated. When the high current was applied, the dewetted copper forming around the edge was observed at the cathode of the conductor. Furthermore, the effect of temperature and conductor size on local dewetting was investigated. Our proposed mechanism for local dewetting is in good agreement with experimental findings.

AB - The continuous downscaling of microelectronics has introduced many reliability issues on interconnect. Electromigration and dewetting are major reliability concerns in high-temperature micro- and nanoscale devices. In this paper, the local dewetting of copper thin film during the electromigration test was first found and investigated. When the high current was applied, the dewetted copper forming around the edge was observed at the cathode of the conductor. Furthermore, the effect of temperature and conductor size on local dewetting was investigated. Our proposed mechanism for local dewetting is in good agreement with experimental findings.

KW - Copper

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BT - Proceedings of the 2023 IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference, IITC/MAM 2023

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Electromigration-induced local dewetting in Cu films

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