Establishing the interfacial fracture properties of cu-emc interfaces at harsh condition

M Sadeghinia, KMB Jansen, LJ Ernst, H Pape

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

1 Citation (Scopus)
Original languageEnglish
Title of host publicationProceedings of the 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and Microsystems, EuroSimE 2012
Place of Publications.l.
PublisherIEEE Society
Pages1-4
Number of pages4
ISBN (Print)978-1-4673-1513-5
Publication statusPublished - 2012
EventEuroSimE 2012: 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Lisbon, Portugal
Duration: 16 Apr 201218 Apr 2012
Conference number: 13

Conference

ConferenceEuroSimE 2012
CountryPortugal
CityLisbon
Period16/04/1218/04/12

Keywords

  • Conf.proc. > 3 pag

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