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Evolution of the Microstructure of Sn58Bi Solder Paste with Sn-3.0Ag-0.5Cu Addition During Isothermal Aging
Ruisheng Xu, Yang Liu*, Hao Zhang, Zhao Li, Fenglian Sun, Guoqi Zhang
*Corresponding author for this work
Research output: Contribution to journal › Article › Scientific › peer-review
20
Citations
(Scopus)