Finite element modeling of solder interconnection reliability with variable solder geometry

XJ Zhao; G.Q. Zhang; JFJ Caers; LJ Ernst

Finite element modeling of solder interconnection reliability with variable solder geometry

XJ Zhao, G.Q. Zhang, JFJ Caers, LJ Ernst

Dynamics of Micro and Nano Systems

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

Original language	Undefined/Unknown
Title of host publication	Proceedings of the 2nd international conference on benefiting from thermal and mechanical simulation in (micro)-electronics, April 9-11
Editors	GQ Zhang, LJ Ernst, de O Saint Leger
Place of Publication	Paris
Publisher	Europia
Pages	337-342
Number of pages	6
ISBN (Print)	0-7803-9806-8
Publication status	Published - 2001
Event	EuroSimE 2001 - Paris, France Duration: 9 Apr 2001 → 11 Apr 2001

Publication series

Name
Publisher	Europia

Conference

Conference	EuroSimE 2001
Country/Territory	France
City	Paris
Period	9/04/01 → 11/04/01

Keywords

ZX Int.klas.verslagjaar < 2002

Cite this

@inproceedings{eb6e1fa055874d898cc492a6ad0519a4,

title = "Finite element modeling of solder interconnection reliability with variable solder geometry",

keywords = "ZX Int.klas.verslagjaar < 2002",

author = "XJ Zhao and G.Q. Zhang and JFJ Caers and LJ Ernst",

year = "2001",

language = "Undefined/Unknown",

isbn = "0-7803-9806-8",

publisher = "Europia",

pages = "337--342",

editor = "{GQ Zhang} and {LJ Ernst} and {O Saint Leger}, de",

booktitle = "Proceedings of the 2nd international conference on benefiting from thermal and mechanical simulation in (micro)-electronics, April 9-11",

note = "EuroSimE 2001 ; Conference date: 09-04-2001 Through 11-04-2001",

}

Zhao, XJ, Zhang, GQ, Caers, JFJ & Ernst, LJ 2001, Finite element modeling of solder interconnection reliability with variable solder geometry. in GQ Zhang, LJ Ernst & D O Saint Leger (eds), Proceedings of the 2nd international conference on benefiting from thermal and mechanical simulation in (micro)-electronics, April 9-11. Europia, Paris, pp. 337-342, EuroSimE 2001, Paris, France, 9/04/01.

Finite element modeling of solder interconnection reliability with variable solder geometry. / Zhao, XJ; Zhang, G.Q.; Caers, JFJ et al.
Proceedings of the 2nd international conference on benefiting from thermal and mechanical simulation in (micro)-electronics, April 9-11. ed. / GQ Zhang; LJ Ernst; de O Saint Leger. Paris: Europia, 2001. p. 337-342.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

TY - GEN

T1 - Finite element modeling of solder interconnection reliability with variable solder geometry

AU - Zhao, XJ

AU - Zhang, G.Q.

AU - Caers, JFJ

AU - Ernst, LJ

PY - 2001

Y1 - 2001

KW - ZX Int.klas.verslagjaar < 2002

M3 - Conference contribution

SN - 0-7803-9806-8

SP - 337

EP - 342

BT - Proceedings of the 2nd international conference on benefiting from thermal and mechanical simulation in (micro)-electronics, April 9-11

A2 - GQ Zhang, null

A2 - LJ Ernst, null

A2 - O Saint Leger, de

PB - Europia

CY - Paris

T2 - EuroSimE 2001

Y2 - 9 April 2001 through 11 April 2001

ER -