Geometry Sensitivity Analyses of Microstructures of IC Packages on Passivation Cracking

Y He, F Li, R Shi, GQ Zhang, LJ Ernst, J Zhang, ZT Song

Research output: Contribution to journalArticlepeer-review

Original languageUndefined/Unknown
Pages (from-to)819-824
Number of pages6
JournalKey Engineering Materials
Publication statusPublished - 2005

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  • academic journal papers
  • CWTS JFIS < 0.75

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