@article{231de55ad58042d1a5c479a46bbf2671,
title = "Geometry Sensitivity Analyses of Microstructures of IC Packages on Passivation Cracking",
keywords = "academic journal papers, CWTS JFIS < 0.75",
author = "Y He and F Li and R Shi and GQ Zhang and LJ Ernst and J Zhang and ZT Song",
note = "Nog niet eerder opgevoerd",
year = "2005",
language = "Undefined/Unknown",
volume = "297-300",
pages = "819--824",
journal = "Key Engineering Materials",
issn = "1013-9826",
publisher = "Trans Tech Publications",
}