Heat Transfer Enhancement in Passively Cooled 5G Base Station Antennas Using Thick Ground Planes

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Abstract

The thermal and electromagnetic effects of varying the ground plane thickness and aperture size of the 5G integrated base station antennas are investigated. A double-sided PCB structure is designed with antennas and digital beamforming chips on the opposite sides. Fully-passive cooling is achieved by using fanless CPU coolers attached to the chips. The simulation results indicate that as compared to the standard counterparts, much better cooling performance can be achieved using relatively thick ground planes with extended aperture sizes, with no significant effect on the electromagnetic properties.
Original languageEnglish
Title of host publication2019 13th European Conference on Antennas and Propagation (EuCAP)
PublisherIEEE
Pages1-5
Number of pages5
ISBN (Electronic)978-88-907018-8-7
ISBN (Print)978-1-5386-8127-5
Publication statusPublished - 2019
EventEuCAP 2019: 13th European Conference on Antennas and Propagation - Krakow, Poland
Duration: 31 Mar 20195 Apr 2019
Conference number: 13

Conference

ConferenceEuCAP 2019
Abbreviated titleEuCAP
CountryPoland
CityKrakow
Period31/03/195/04/19

Keywords

  • active integrated antenna
  • base station antenna
  • fifth generation (5G)
  • millimeter-wave communication
  • passive cooling
  • thick ground plane

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    • 1 Dissertation (TU Delft)
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