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High Power-Density 3D Integrated Power Supply Module Based on Panel-Level PCB Embedded Technology
Fengze Hou, Xueping Guo, Qidong Wang, Wenbo Wang, Tingyu Lin, Liqiang Cao, G.Q. Zhang, J.A. Ferreira
Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review
15
Citations
(Scopus)