Interface Characterization and Failure Modeling for Semiconductor Packages

LJ Ernst, A Xiao, B Wunderle, KMB Jansen, H Pape

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

15 Citations (Scopus)

Original language	Undefined/Unknown
Title of host publication	Proceedings EPTC 2008
Editors	R Lee
Place of Publication	Singapore
Publisher	IEEE
Pages	808-815
Number of pages	8
ISBN (Print)	978-1-4244-2117-9
Publication status	Published - 2008
Event	Electronic Packaging Technology Conference - Singapore Duration: 9 Dec 2008 → 12 Dec 2008

Name
Publisher	IEEE

Conference	Electronic Packaging Technology Conference
Period	9/12/08 → 12/12/08

Keywords

@inproceedings{55b53b7024aa4864893fcfb7897e6808,

title = "Interface Characterization and Failure Modeling for Semiconductor Packages",

keywords = "Conf.proc. > 3 pag",

author = "LJ Ernst and A Xiao and B Wunderle and KMB Jansen and H Pape",

year = "2008",

language = "Undefined/Unknown",

isbn = "978-1-4244-2117-9",

publisher = "IEEE",

pages = "808--815",

editor = "R Lee",

booktitle = "Proceedings EPTC 2008",

address = "United States",

note = "Electronic Packaging Technology Conference ; Conference date: 09-12-2008 Through 12-12-2008",

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TY - GEN

T1 - Interface Characterization and Failure Modeling for Semiconductor Packages

AU - Ernst, LJ

AU - Xiao, A

AU - Wunderle, B

AU - Jansen, KMB

AU - Pape, H

PY - 2008

Y1 - 2008

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 978-1-4244-2117-9

SP - 808

EP - 815

BT - Proceedings EPTC 2008

A2 - Lee, R

PB - IEEE

CY - Singapore

T2 - Electronic Packaging Technology Conference

Y2 - 9 December 2008 through 12 December 2008

ER -