Low temperature LPCVD SiN direct bonding for sensors

CL Hsu; G Pandraud; JF Creemer; PJ French; PM Sarro

Low temperature LPCVD SiN direct bonding for sensors

CL Hsu, G Pandraud, JF Creemer, PJ French, PM Sarro

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	Proceedings of the STW annual workshop on semiconductor advances for future electronics and sensors (SAFE 2005)
Editors	s.n.
Place of Publication	Den Haag
Publisher	Dutch Technology Foundation
Pages	162-166
Number of pages	5
ISBN (Print)	90-73461-50-2
Publication status	Published - 2005
Event	STW annual workshop on semiconductor advances for future electronics and sensors (SAFE 2005), Veldhoven, the Netherlands - Utrecht Duration: 17 Nov 2005 → 18 Nov 2005

Publication series

Name
Publisher	Dutch Technology Foundation

Conference

Conference	STW annual workshop on semiconductor advances for future electronics and sensors (SAFE 2005), Veldhoven, the Netherlands
Period	17/11/05 → 18/11/05

Bibliographical note

Bij EWI gehonoreerd als 1V / 100% EI

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

@inproceedings{0b67e414b841452281dd55adff5b07a8,

title = "Low temperature LPCVD SiN direct bonding for sensors",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "CL Hsu and G Pandraud and JF Creemer and PJ French and PM Sarro",

note = "Bij EWI gehonoreerd als 1V / 100% EI; STW annual workshop on semiconductor advances for future electronics and sensors (SAFE 2005), Veldhoven, the Netherlands ; Conference date: 17-11-2005 Through 18-11-2005",

year = "2005",

language = "Undefined/Unknown",

isbn = "90-73461-50-2",

publisher = "Dutch Technology Foundation",

pages = "162--166",

editor = "s.n.",

booktitle = "Proceedings of the STW annual workshop on semiconductor advances for future electronics and sensors (SAFE 2005)",

}

Hsu, CL, Pandraud, G, Creemer, JF, French, PJ & Sarro, PM 2005, Low temperature LPCVD SiN direct bonding for sensors. in s.n. (ed.), Proceedings of the STW annual workshop on semiconductor advances for future electronics and sensors (SAFE 2005). Dutch Technology Foundation, Den Haag, pp. 162-166, STW annual workshop on semiconductor advances for future electronics and sensors (SAFE 2005), Veldhoven, the Netherlands, 17/11/05.

Low temperature LPCVD SiN direct bonding for sensors. / Hsu, CL; Pandraud, G; Creemer, JF et al.
Proceedings of the STW annual workshop on semiconductor advances for future electronics and sensors (SAFE 2005). ed. / s.n. Den Haag: Dutch Technology Foundation, 2005. p. 162-166.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Low temperature LPCVD SiN direct bonding for sensors

AU - Hsu, CL

AU - Pandraud, G

AU - Creemer, JF

AU - French, PJ

AU - Sarro, PM

N1 - Bij EWI gehonoreerd als 1V / 100% EI

PY - 2005

Y1 - 2005

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 90-73461-50-2

SP - 162

EP - 166

BT - Proceedings of the STW annual workshop on semiconductor advances for future electronics and sensors (SAFE 2005)

A2 - s.n., null

PB - Dutch Technology Foundation

CY - Den Haag

T2 - STW annual workshop on semiconductor advances for future electronics and sensors (SAFE 2005), Veldhoven, the Netherlands

Y2 - 17 November 2005 through 18 November 2005

ER -