INIS
low temperature
100%
applications
100%
sintering
100%
nanoparticles
100%
copper
100%
dies
100%
x-ray diffraction
77%
power
44%
air
33%
particles
33%
nanomaterials
33%
time resolution
33%
gases
33%
time dependence
22%
information
22%
packaging
22%
silver
11%
dynamics
11%
temperature control
11%
temperature range
11%
miniaturization
11%
bonding
11%
demand
11%
power supplies
11%
microstructure
11%
connections
11%
optimization
11%
electrical resistance
11%
monitoring
11%
intermetallic compounds
11%
volume
11%
defects
11%
investigations
11%
synthesis
11%
cost
11%
detection
11%
industry
11%
interference
11%
environment
11%
validation
11%
Material Science
Materials
100%
Copper
100%
Nanoparticle
100%
Sintering Temperature
100%
Sintering
83%
Characterization
83%
Temperature
50%
Air
50%
Nanocrystalline Material
50%
Time-Resolved X-Ray Diffraction
50%
X-Ray Diffraction
50%
Gas
50%
Pressure-Assisted Sintering
33%
Particle
33%
Soldering Alloys
16%
Silver Nanoparticle
16%
Microstructure
16%
Microelectromechanical System
16%
Materials Synthesis
16%
Diffraction Measurement
16%
Packaging Material
16%
Diffraction Pattern
16%
Electrical Resistance
16%
Materials Processing
16%
Metallic Particle
16%
Intermetallics
16%
X Ray Diffraction Analysis
16%
Conductivity
16%
Keyphrases
Nanomaterial Characterization
18%
Power Electronics Applications
18%
Particle Sintering
9%
Cu Joint
9%
Electronic Packaging Technology
9%
Diffraction Microstructure
9%
Sintering Behavior
9%
Electronic Packaging Materials
9%
Novation
9%
In-situ Electrical Resistance
9%
Paste Characterisation
9%
All-copper Interconnects
9%
Ther
9%
Sn-Ag-Cu Solder
9%
Engineering
Characterization of Nanomaterials
20%