Microstructure and hardness of SAC305 and SAC305-0.3Ni solder on Cu, high temperature treated Cu, and graphene-coated Cu substrates

Shengli Li, Yang Liu, Hao Zhang, Hongming Cai, Fenglian Sun, Guoqi Zhang

Research output: Contribution to journalArticleScientificpeer-review

9 Citations (Scopus)
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Abstract

In this study, SAC305 and SAC305-0.3Ni solder balls were soldered onto Cu, high temperature treated Cu (H-Cu) and graphene coated Cu (G-Cu) substrates, respectively. The microstructure, the interfacial reaction, and the hardness of the solder joints were investigated. The interfacial intermetallic compound (IMC) is Cu6Sn5 in the solder joints of SAC305/Cu, SAC305/H-Cu, and SAC305/G-Cu. With the addition of 0.3 wt% Ni in the SAC305 solder, the interfacial IMC on Cu, H-Cu, and G-Cu transforms from Cu6Sn5 into (Cu, Ni)6Sn5. The thickness of Cu6Sn5 and (Cu, Ni)6Sn5 is the lowest on G-Cu substrate. Meanwhile, smooth (Cu, Ni)6Sn5 interfacial IMC layers are obtained in SAC305-0.3Ni/H-Cu and SAC305-0.3Ni/G-Cu solder joints. Both the SAC305 and the SAC305-0.3Ni solder bulks have the highest β-Sn content and the lowest concentration of eutectic phases on G-Cu substrate. Consequently, the hardness of the solder bulks on G-Cu is lower than that on the other two kinds of substrates.

Original languageEnglish
Pages (from-to)617-622
Number of pages6
JournalResults in Physics
Volume11
DOIs
Publication statusPublished - 2018

Keywords

  • Graphene
  • Hardness
  • Microstructure
  • Sn-Ag-Cu
  • Soldering

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