On-chip interconnect for mm-wave applications using an all-copper technology and wavelengt reduction

TSD Cheung, JR Long, K Vaed, R Volant, A Chinthakindi, CM Schnabel, J Florkey, K Stein

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	Digest of Technical Papers IEEE International solid-state circuits conference (ISSCC)
Pages	396-397
Number of pages	2
Publication status	Published - 2003

Name

Name
Volume	1

Keywords

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title = "On-chip interconnect for mm-wave applications using an all-copper technology and wavelengt reduction",

keywords = "Geen BTA classificatie",

author = "TSD Cheung and JR Long and K Vaed and R Volant and A Chinthakindi and CM Schnabel and J Florkey and K Stein",

year = "2003",

language = "Undefined/Unknown",

isbn = "0-7803-7707-9",

pages = "396--397",

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On-chip interconnect for mm-wave applications using an all-copper technology and wavelengt reduction. / Cheung, TSD; Long, JR; Vaed, K et al.
Digest of Technical Papers IEEE International solid-state circuits conference (ISSCC). 2003. p. 396-397.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - On-chip interconnect for mm-wave applications using an all-copper technology and wavelengt reduction

AU - Cheung, TSD

AU - Long, JR

AU - Vaed, K

AU - Volant, R

AU - Chinthakindi, A

AU - Schnabel, CM

AU - Florkey, J

AU - Stein, K

PY - 2003

Y1 - 2003

KW - Geen BTA classificatie

M3 - Conference contribution

SN - 0-7803-7707-9

SP - 396

EP - 397

BT - Digest of Technical Papers IEEE International solid-state circuits conference (ISSCC)

ER -