On lead-free soldering of QFP, BGA components on PCBs with different finishes for industrial applications

M Biglari; G Gerrits; M Helvoort; WG Sloof; ER Peekstok; MH Biglari

On lead-free soldering of QFP, BGA components on PCBs with different finishes for industrial applications

M Biglari, G Gerrits, M Helvoort, WG Sloof, ER Peekstok, MH Biglari

Materials Science and Engineering

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	Proceedings of the 15th European Microelectronics and Packaging Conference (IMAPS)
Editors	s.n.
Place of Publication	Brugge, Belgie
Publisher	IMAPS
Pages	1-9
Number of pages	9
Publication status	Published - 2005
Event	15th European Microelectronics and Packaging Conference, Brugge, Belgium - Brugge, Belgie Duration: 12 Jun 2005 → 15 Jun 2005

Publication series

Name
Publisher	IMAPS2005

Conference

Conference	15th European Microelectronics and Packaging Conference, Brugge, Belgium
Period	12/06/05 → 15/06/05

Bibliographical note

Nog niet eerder opgevoerd

Keywords

Conf.proc. > 3 pag

Cite this

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title = "On lead-free soldering of QFP, BGA components on PCBs with different finishes for industrial applications",

keywords = "Conf.proc. > 3 pag",

author = "M Biglari and G Gerrits and M Helvoort and WG Sloof and ER Peekstok and MH Biglari",

note = "Nog niet eerder opgevoerd; 15th European Microelectronics and Packaging Conference, Brugge, Belgium ; Conference date: 12-06-2005 Through 15-06-2005",

year = "2005",

language = "Undefined/Unknown",

publisher = "IMAPS",

pages = "1--9",

editor = "s.n.",

booktitle = "Proceedings of the 15th European Microelectronics and Packaging Conference (IMAPS)",

}

Biglari, M, Gerrits, G, Helvoort, M, Sloof, WG, Peekstok, ER & Biglari, MH 2005, On lead-free soldering of QFP, BGA components on PCBs with different finishes for industrial applications. in s.n. (ed.), Proceedings of the 15th European Microelectronics and Packaging Conference (IMAPS). IMAPS, Brugge, Belgie, pp. 1-9, 15th European Microelectronics and Packaging Conference, Brugge, Belgium, 12/06/05.

On lead-free soldering of QFP, BGA components on PCBs with different finishes for industrial applications. / Biglari, M; Gerrits, G; Helvoort, M et al.
Proceedings of the 15th European Microelectronics and Packaging Conference (IMAPS). ed. / s.n. Brugge, Belgie: IMAPS, 2005. p. 1-9.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - On lead-free soldering of QFP, BGA components on PCBs with different finishes for industrial applications

AU - Biglari, M

AU - Gerrits, G

AU - Helvoort, M

AU - Sloof, WG

AU - Peekstok, ER

AU - Biglari, MH

N1 - Nog niet eerder opgevoerd

PY - 2005

Y1 - 2005

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SP - 1

EP - 9

BT - Proceedings of the 15th European Microelectronics and Packaging Conference (IMAPS)

A2 - s.n., null

PB - IMAPS

CY - Brugge, Belgie

T2 - 15th European Microelectronics and Packaging Conference, Brugge, Belgium

Y2 - 12 June 2005 through 15 June 2005

ER -